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FHR Anlagenbau GmbH

Profile

Pioneer Engineering in Thin-Film Technologies

Founded in 1991 by a group of Dresden-based engineers, FHR Anlagenbau GmbH is an innovative company focused on vacuum process technology and special plant construction. Using their many years of experience in thin film technology, our engineers create both state-of-the-art solutions for thin film applications and tailor-made plant designs.


Today, with its more than 165 employees at its location at Ottendorf-Okrilla, FHR Anlagenbau GmbH is a recognized and successful vacuum process systems engineering company with a global customer base in both research and industry.


FHR Anlagenbau GmbH became a 100 percent owned subsidiary of centrotherm photovoltaics AG, a leading international supplier of technology and services for the production of solar cells and solar silicon, in 2008


Our core skills in thin-film technology



  • Reactive and non-reactive magnetron sputtering, vapour deposition under vacuum, CVD and PECVD processes for highly efficient deposition of metals, oxides and nitrides

  • Plasma-enhanced etching technologies for surface treatment and ultra-efficient material removal (high-rate etching)

  • Atomic layer deposition for cutting ultra-thin functional layers of homogenous layer thickness on complex 3D-surface structures


Our core skills in special plant construction



  • Cluster systems for the treatment and coating of small-area substrates and wafers

  • Roll-to-roll systems for the coating of foils and flexible substrates (web coating)

  • Inline systems for large-area deposition and coating of architectural glass plates

  • ALD reactors for atomic layer deposition

  • Plasma sources and gas regulation systems

  • Sputter targets, individually made and bonded to cooling bodies


FHR Technologies

Magnetron sputtering

Thin films made of sputtered cathode material

  • Deposition of metals, alloys, oxides and nitrides
  • Reactive and non-reactive magnetron sputtering techniques

Sputter deposition is a thin-film technology which is classified as a physical vapour deposition (PVD) method. The material which is to be deposited (target material) is first sputtered (atomised) by way of ion bombardment in a plasma and thereby transformed to the vapour phase. The particle vapour is then deposited as a thin film on the substrate to be coated

FHR is a global technological leader in the field of sputter deposition. We offer you special know-how for reactive and non-reactive magnetron sputtering processes using DC, pulsed DC, MF and HF power supplies. Those sputter technologies which fit the customer needs best depending on type of materials used, desired layer properties and deposition rates will be integrated into tailor-made coating systems.

Sputter technology integration options

  • Cluster systems
  • Roll-to-roll systems
  • Inline systems

Typical applications for magnetron sputtering

  • Semiconductor
  • OLED displays
  • MEMS & NEMS
  • Optics
  • Architecture glass
  • Photovoltaics
  • Solar thermals
Thermal vapour deposition

Functional layers of condensed particle vapour

  • Allows very high deposition rates
  • Individual material mix thanks to the possibility of co-evaporation

Thermal vapour deposition under vacuum is a physical vapour deposition (PVD) technology, just like sputter deposition (magnetron sputtering). Whereas the transition of the coating material to the vapour phase is caused by ion bombardment in magnetron sputtering, thermal vapour deposition means that specially designed heaters heat up the coating material so that it evaporates (liquids) or sublimates (solids). The thus generated particle vapour is then deposited on the substrate to be coated.

Among the different PVD thin-film technologies, thermal vapour deposition allows particularly high deposition rates to be achieved, depending on coating material and desired layer properties. In order to guarantee our customers optimum process parameters for vapour deposition, we fit our products out individually with particularly suited evaporation sources (crucibles or saggars, line or jet evaporators, or custom-made evaporators).

Thermal vapour deposition integration options

  • Cluster systems
  • Roll-to-roll systems
  • Inline systems

Typical applications for thermal evaporation

  • Semiconductor
  • Sensors
  • MENS & NEMS

Product

Photovoltaics - Our products for Industry and Research

Special plant construction for photovoltaic applications
  1. Inline systems Inline systems

    Inline concepts are the right answer for high-productivity deposition and coating of substrates with a large surface area. We offer inline solutions with horizontal or vertical substrate positioning which are individually tailored to your substrate size requirements. Manual or fully-automated transport modes and subsrate pre-treatment through heating or etching can also be integrated on a customer-specific basis. (please contact us for more detail)

  2. Roll-to-roll systems Roll-to-roll systems

    Modern electronics are anything but rigid. Our roll-to-roll coating plants offer the right plant concept for the production of e.g. flexible solar cells, organic display films or "bendy" sensors. We use metal and plastic films as substrate materials, and the coating width is chosen to meet our customers� individual specifications. Our concept offers maximum flexibility for the process engineering fields of sputtering and vapour deposition. A freely programmable winding system and closed-loop control of the substrate temperature allow the system to process various different substrate materials and film thicknesses in a wide process window. We have the necessary expertise required to integrate in-situ process measuring equipment and the online process control systems which are derived from them. (please contact us for more detail)

  3. Cluster systems Cluster systems

    With unsurpassed flexibility in terms of the process chamber outfits and general substrate handling capability, our cluster systems are the system of choice for high-tech R& D applications. In addition, cluster concepts are the industry standard for solutions in microelectronics and for wafter-like substrates. The choice is yours: in many cases we can offer modular solutiosn for your chosen process and substrate diameter which are already tried and tested. However,we are also happy to develop an individual solution for your required configuration. (please contact us for more detail)

  4. Bonded sputtering targets Bonded sputtering targets

    FHR boasts many years of experience in making bonded sputtering targets and possesses unique industrial know-how which is under continuous improvement. So we are especially pleased to offer our customers the bonding of rotary targets. Currently, we manufacture cylindrical targets up to 2,500 mm length. (please contact us for more detail)

Process technologies which can be integrated on a customer-specific basis
    • Magnetron sputtering
    • Thermal evaporation
    • Chemical vapor deposition (CVD) / Plasma-enhanced chemical vapor deposition (PECVD)
    • Plasma etching (PE) / Reactive ion etching (RIE)
    • Annealing (FLA & RTP)

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