Euflex Technology Corp_mechatronic Handling Machines
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mechatronic

Profile

mechatronic systemtechnik is a successful, fast-growing high-tech company headquartered in Villach, Austria. Since 2004 we have been developing specialised machines for handling thin or warped wafers in the semiconductor industry such as TAIKO, MEMS, film frame, eWLB etc.

mechatronics fully automated handling systems are used for noncontact transport of wafers. For this, various procedures and equipment have been developed such as the Bernoulli and also the vacuum technology which are applied individually according to customer demands. We are the worlds only company able to handle thin and ultra thin wafers both on the chip side and on the rear of the wafer.

Product


Handling Machines?


Packing Tools:

I. Packing Tool mPT 200/300 (150/200)

The Packing Tool mPT 200/300 is designed for packing and unpacking of 8"/12� (or 6�/8�) wafers by using Bernoulli vacuum end-effectors.


Features:

  • Wafer size: 8"/12� (or 6�/8)
  • handling of standard, thin, warped, eWLB, Taiko and MEMS wafers
  • highest level of reliability and availability
  • two 6 axle robots for optimized footprint
  • up to 8 stations for shipping boxes and packing material
  • automatic end-effector changing station
  • two load-ports
  • mapping sensor
  • pre-aligner for 8"/12" (or 6�/8�)
  • SECS/GEM interface
  • CE certificated
  • SEMI standard compliant


Applications:

  • packing
  • unpacking




Wafer Loader:

II. Wafer Loader mWL 200/300 (150/200)

The Wafer Loader mWL 200/300 is designed for fully automated loading and unloading of 8"/12" (or 6�/8�) wafers or frame cassettes from FOUPs/FOSBs onto an external chuck.

The adaptation to OEM tools according to customer requirements is possible.



Features:

  • Wafer size: 8"/12" (or 6�/8�)
  • handling of standard, thin, warped, eWLB Taiko and MEMS wafers
  • handling of frames
  • highest level of reliability and availability
  • optimized footprint
  • automatic end-effector changing station
  • two load-ports
  • mapping sensor
  • pre-aligner for 8"/12" (or 6�/8�)
  • SECS/GEM interface
  • CE certificated
  • SEMI standards compliant



Applications:

  • loading/unloading on a chuck
  • wafer handling automation (e.g. for process, inspection, metrology tools etc.)




TAIKO Ring Remover:

III. Ring Remover mRR 300 (200)

The Ring Remover mRR enables fully automated handling of film frames and removing pre-cut rings from the laminated wafer 12" (or 8�).


Features:

  • Wafer size: 12" (or 8�)
  •  throughput up to 60 wafers on film per hour
  •  highest level of reliability and abailability
  •  optimized footprint 
  •  two ring remover stations
  •  two load-ports
  •  SECS/GEM interface
  •  CE certificated 
  •  SEMI standard compliant 


Applications:

  • automated ring removing



Wafer Sorter:

IV. Wafer Sorter mWS 200/300 (150/200)

The Wafer Sorter mWS 200/300 is designed for sorting 8�/12" (or 6�/8�) wafers and can be equipped with up to four cassettes or FOUPs (mixed loading possible).

The mWS 200/300 handles wafers out of a cassette / FOUP onto a pre-aligner, forward onto a visual inspection unit and back into a cassette / FOUP.



Features: 

  • Wafer sizes: 8�/12� (or 6�/8�)
  • handling of standard, thin, warped, eWLB, Taiko and MEMS wafers
  • highest level of reliability and availability
  • one dual arm robot on linear track
  • up to four load ports
  • wafer flipping function
  • automatic end-effector changing station
  • mapping sensor
  • pre-aligner for 8"/12" (or 6�/8�)
  • SECS/GEM interface
  • CE certificated
  • SEMI standards compliant


Applications:

  • sorting
  • splitting
  • merging



Components?


End-Effectors:

I. Bernoulli Vacuum End-Effectors

The Bernoulli vacuum end-effectors (mBV series) are designed for back side handling of thin and warped wafers, e.g. for handling from the cassette to the pre-aligner.



Types according to wafer size:

  • 6� (mBV 150)
  • 8� (mBV 200)


Function:

The Bernoulli vacuum end-effectors use Bernoulli air-flow and vacuum one after the other. For flattening the warped wafer in the cassette a short burst of clean dry air (CDA) or nitrogen is applied to bring the wafer into the right position. Via vacuum the wafer is secured on the end-effecto.



Features:

  • Wafer sizes: 6�, 8�
  • For thin-wafers > 50 �m (2 mil)
  • Warped wafer handling (up to 12 mm warpage)
  • Back side handling
  • Bernoulli airflow and vacuum
  •  Automated quick coupling
  •  Automated loading and unloading of several mechatronic components




II. Contactless End-Effectors

The contactless end-effectors (mCL series) are designed for contactless chip side & back side handling of thin and warped wafers, e.g. out of and into a cassette.


Types according to wafer size:

  • 6� (mCL 150)
  • 8� (mCL 200)

  • 12� (mCL 300) 


Function:

The contactless end-effectors use only Bernoulli airflow (no vacuum). The wafer is hovering on the air cushion 0.2 - 0.3 mm above or below the end-effector and is limited sideways by PEEK-elements.

This end-effector does not require the wafer to be fully planarized. Even warped wafers which are too stiff for other systems can be handled.



Features: 

  • Wafer sizes: 6�, 8�,12�
  • For thin-wafers > 50 �m (2 mil)
  • Warped wafer handling (up to 12 mm warpage)
  • Chip side and back side handling
  • Contacless handling with Bernoulli airflow
  • Wafer detection with capacitive sensing
  • Automated quick coupling
  • Automated loading and unloading of several mechatronic components
  • Antistatic surface

  

      

      Chucks:

III.  Thin wafer chuck

mechatronic vacuum chucks (mVC) are designed for secure placement of various wafer types (eg. standard, (ultra-)thin/warped, eWLB, Taiko, film-frame, MEMS) in a defined orientation.  These chucks are mainly integrated in OEM-equipment (eg. for inspection measurement, defect detection �) under atmospheric conditions.

By using a special porous ceramic, the wafer is held on its backside without contacting the wafer chipside. The vacuum holding force is evenly spread on the entire backside surface to flatten the wafer.




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