Pioneer Engineering in Thin-Film Technologies
Founded in 1991 by a group of Dresden-based engineers, FHR Anlagenbau GmbH is an innovative company focused on vacuum process technology and special plant construction. Using their many years of experience in thin film technology, our engineers create both state-of-the-art solutions for thin film applications and tailor-made plant designs.
Today, with its more than 165 employees at its location at Ottendorf-Okrilla, FHR Anlagenbau GmbH is a recognized and successful vacuum process systems engineering company with a global customer base in both research and industry.
FHR Anlagenbau GmbH became a 100 percent owned subsidiary of centrotherm photovoltaics AG, a leading international supplier of technology and services for the production of solar cells and solar silicon, in 2008
Our core skills in thin-film technology
Our core skills in special plant construction
Thin films made of sputtered cathode material
Sputter deposition is a thin-film technology which is classified as a physical vapour deposition (PVD) method. The material which is to be deposited (target material) is first sputtered (atomised) by way of ion bombardment in a plasma and thereby transformed to the vapour phase. The particle vapour is then deposited as a thin film on the substrate to be coated
FHR is a global technological leader in the field of sputter deposition. We offer you special know-how for reactive and non-reactive magnetron sputtering processes using DC, pulsed DC, MF and HF power supplies. Those sputter technologies which fit the customer needs best depending on type of materials used, desired layer properties and deposition rates will be integrated into tailor-made coating systems.
Sputter technology integration options
Typical applications for magnetron sputtering
Functional layers of condensed particle vapour
Thermal vapour deposition under vacuum is a physical vapour deposition (PVD) technology, just like sputter deposition (magnetron sputtering). Whereas the transition of the coating material to the vapour phase is caused by ion bombardment in magnetron sputtering, thermal vapour deposition means that specially designed heaters heat up the coating material so that it evaporates (liquids) or sublimates (solids). The thus generated particle vapour is then deposited on the substrate to be coated.
Among the different PVD thin-film technologies, thermal vapour deposition allows particularly high deposition rates to be achieved, depending on coating material and desired layer properties. In order to guarantee our customers optimum process parameters for vapour deposition, we fit our products out individually with particularly suited evaporation sources (crucibles or saggars, line or jet evaporators, or custom-made evaporators).
Thermal vapour deposition integration options
Typical applications for thermal evaporation
Inline concepts are the right answer for high-productivity deposition and coating of substrates with a large surface area. We offer inline solutions with horizontal or vertical substrate positioning which are individually tailored to your substrate size requirements. Manual or fully-automated transport modes and subsrate pre-treatment through heating or etching can also be integrated on a customer-specific basis. (please contact us for more detail)
Modern electronics are anything but rigid. Our roll-to-roll coating plants offer the right plant concept for the production of e.g. flexible solar cells, organic display films or "bendy" sensors. We use metal and plastic films as substrate materials, and the coating width is chosen to meet our customers� individual specifications. Our concept offers maximum flexibility for the process engineering fields of sputtering and vapour deposition. A freely programmable winding system and closed-loop control of the substrate temperature allow the system to process various different substrate materials and film thicknesses in a wide process window. We have the necessary expertise required to integrate in-situ process measuring equipment and the online process control systems which are derived from them. (please contact us for more detail)
With unsurpassed flexibility in terms of the process chamber outfits and general substrate handling capability, our cluster systems are the system of choice for high-tech R& D applications. In addition, cluster concepts are the industry standard for solutions in microelectronics and for wafter-like substrates. The choice is yours: in many cases we can offer modular solutiosn for your chosen process and substrate diameter which are already tried and tested. However,we are also happy to develop an individual solution for your required configuration. (please contact us for more detail)
FHR boasts many years of experience in making bonded sputtering targets and possesses unique industrial know-how which is under continuous improvement. So we are especially pleased to offer our customers the bonding of rotary targets. Currently, we manufacture cylindrical targets up to 2,500 mm length. (please contact us for more detail)