There are multiple factors contributing to the ideal position of the end effector when picking or placing the substrate. These include substrate-driven factors (e.g. bow and warpage), cassette-driven factors (e.g. tilt or deformation), and hardware-driven factors (e.g. the thickness of the end effector). With non-standard substrates, there is a very tight margin of error and this calls for very precise mapping.
There are multiple factors contributing to the ideal position of the end effector when picking or placing the substrate. These include substrate-driven factors (e.g. bow and warpage), cassette-driven factors (e.g. tilt or deformation), and hardware-driven factors (e.g. the thickness of the end effector). With non-standard substrates, there is a very tight margin of error and this calls for very precise mapping.
| mechatronic systemtechnik gmbh wafer scanner Our wafer scanner detects the exact position of wafers in a cassette (e.g. slot allocation, wafer warpage and wafer location. We are the only company with this capability.
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| Mapping integrated in Sinfonia Load port Our wafer mapping can also be easily integrated in Sinfonia Load Ports. This allows a wafer to be transferred between the FOUP and the inside of a semiconductor fabrications.
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| Reflection sensor Reflection sensors are key elements of wafer mapping.
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| mechatronic systemtechnik gmbh through beam sensor We aim to give our customers special solutions such as determining important information like ring detections with our through beam sensors.
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