Wafer Packer (mPT)

The fully automated wafer packer (mPT) for packing and unpacking of substrates into shipping boxes or from shipping boxes represents the latest generation of wafer packers with the highest level of flexibility for substrate types, substrate sizes and material types in combination with the highest reliability. Consistent implementation of mechatronic´s modular design concept and a sophisticated sensor technology guarantee full compatibility with the widest variety of wafer carriers (including open cassettes, FOUPs, FOSBs) and packing material (foam, interleave, ring separators).

mechatronic systemtechnik gmbh´s packer mPT is designed to enable a safe and reliable packing process, in combination with host notification of cassette ID and substrate ID. mechatronic packing chuck is the centerpiece of mPT providing the biggest number of available functions in the industry.