The mechatronic ring remover offers precise and efficient removal of rings from wafers, ensuring a smooth and reliable process. It is equipped with advanced sensors and control systems to handle various types of rings and wafers with high accuracy.On the other hand, the mechatronic laser cutter provides precise and clean cutting of wafers, enabling customization of wafer sizes and shapes with exceptional precision. It utilizes state-of-the-art laser technology to achieve accurate cuts without causing damage to the substrate.
The Ring Remover mRR 300 enables fully automatedhandling of ...
The Ring Remover mRR 200 enables fully automated handling of...
版權所有 © 展締科技股份有限公司. All Rights Reserved.
