The Ring Remover mRR 300 enables fully automatedhandling of film frames and removing pre-cut rings from the laminated wafer 300 mm (12“).
Ring Remover Fully Automatic Ring Separation
Wafer with a thickness less than 80 micron stabilized after grinding with a ring on the outer perimeter. Before dicing it is necessary to remove the stabilization ring. Using this method lowers the risks of thin wafer handling (breakage, edge chipping) and decreases warpage. Prior to final processing, wafers must be separated from the ring. The mechatronic Ring Removers Series mRR fully automatically removes the ring.
Features:
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