Mechatronic Systemtechnik, based in Villach, Austria, is a leading high-tech company that has experienced rapid growth since its establishment in 2004. Specializing in module assembly, Mechatronic develops and manufactures specialized equipment for handling, sorting, transporting, flipping, aligning, and packaging thin and ultra-thin wafers (such as TAIKO, MEMS, film frame, FOWLB) in semiconductor production environments.

Known for its fully automated non-contact handling systems, Mechatronic is the sole provider worldwide capable of handling thin and ultra-thin wafers on both sides simultaneously. The company offers tailored solutions using proprietary thin wafer handling systems and innovative technologies, distinguishing itself as the global leader in non-contact wafer handling automation.

Mechatronic serves a prestigious clientele including industry leaders such as Infineon, TSMC, UMC, STATS ChipPAC, Solarius, Nikon, OC Oerlikon, Rudolph Technologies, STATS ChipPAC, and SÜSS.