Laser cutting unit
Features:
- Precise work due to exact alignment by improved sensors
- High-end laser system - enables adjustment of the position and focus of the laser cut through SW
- settings
- Exhaust system in combination with air curtain - eliminates redeposition
Removal unitFeatures:
- Wafer centering unit, similar to mechatronic pre-aligner centers the wafer prior to the removal step
- Integrated metrology confirms the successful execution of the removal step
- UV treatment prior to ring removal to minimize mechanical stress
- Film frame face down during the ring removing process to ensure superior defectivity performance
