Epoxy resin adhesives and potting compounds are widely used in many industrial applications.
Generally speaking, the materials are characte-rized by the fact that they are internally very rigid, adhere well to a multitude of surfaces and are highly resistant to temperature loads and chemical influences. The material properties with respect to flow behavior, curing speed and flexibility can be adjusted across a relatively wide spectrum.


Extremely diverse usage and processing conditions
Epoxy resin adhesives and potting compounds are generally optimized for specific areas of use and applications. In addition it is often required that they can be used in a wide range of production processing.
When deciding the ideal product for a specific application certain issues will be important to consider. The number of components desired, curing temperature, curing time as well as usage conditions are all part of selecting the best product.


Applications for epoxy resin adhesives and potting compounds
Whether products are used in electronics, electrical engineering, optics or medical technology, epoxy resin adhesives and potting compounds help to permanently bond a wide range of materials and to protect sensitive units from environmental influences.


◆ Microelectronics:
SMD assembly, covering units, potting assemblies

◆ Optics:
Positioning lenses and prisms, securing optical sensors, bonding fiber-optic cables

◆ Medical technology:
Autoclavable, biocompatible bonding of medical devices such as endoscopes

◆ Electrical engineering:
Bonding magnets, potting micro switches


Benefits of bonding
Epoxy resin adhesives enable bonding of almost any material combination – even difficult ones such as
metals, plastics, glass or ceramic. As they have a low viscosity, potting compounds even penetrate fine cracks and openings and thereby protect sensitive units against mechanical loads and the influence of most process media such as water, oil or gases.