Polytec EC 101-L-frozen

• Number of Components: 1
• Typical Cure Schedule: 150 °C  / 10 minutes
• Operating Temperature: -55 °C ... +200 °C
• Consistency: soft, creamy paste
• Features: Standard conductive glue, ECA for die attach and chip bonding in microelectronics, USP class VI compliant for medical technology

• Number of Components: 1
• Typical Cure Schedule: 150 °C / 10 minutes
• Operating Temperature: -55 °C ... +200 °C
• Consistency: soft, creamy paste
• Features: ECA for die attach, suitable for dispensing and screen printing

• Number of Components: 1
• Typical Cure Schedule: 150 °C / 5 minutes
• Operating Temperature: -55 °C ... +200 °C
• Consistency: soft paste
• Features: pre-mixed frozen ECA for fast stamping /pin-transfer, die attach

• Number of Components: 1
• Typical Cure Schedule: 150 °C / 5 minutes
• Operating Temperature:  up to 220 °C
• Consistency: creamy paste
• Features: pre-mixed-frozen, excellent electrical and thermal conductivity, high glass transition temperature