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Electrically Conductive Adhesives
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2-component Conductive Epoxies3
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2-component Conductive Epoxies

Connection technology for applications in electronics, electrical engineering and for smart cards.

Specifications and Description

Polytec EC 101

  • Number of Components: 2
  • Typical Cure Schedule: 120 °C  / 15 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: soft, creamy paste
  • Features: Standard conductive glue, ECA for die attach and chip bonding in microelectronics, USP class VI compliant for medical technology


Polytec EC 151-L
  • Number of Components: 1
  • Typical Cure Schedule: 150 °C  / 5 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: soft paste


Polytec EC 201-2
  • Number of Components: 2
  • Typical Cure Schedule: 150 °C / 15 minutes
  • Operating Temperature: -55 °C ... +170 °C
  • Consistency: creamy paste
  • Features: highly flexible electrically conductive epoxy


Polytec EC 244
  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 24 hours
  • Operating Temperature: -55 °C ... +150 °C
  • Consistency: creamy paste
  • Features: conductive glue with short potlife and curing at room temperature

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