Polytec TC 417-2

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 24 hours
• Operating Temperature: -55 °C ... 180 °C
• Consistency: flowable paste
• Features: cures at room temperature, good thermal conductivity, excellent moisture and chemical resistance, very good flowability, solvent-free

• Number of Components: 2
• Typical Cure Schedule: 150 °C / 15 minutes
• Operating Temperature: -55 °C ... 250 °C
• Consistency: soft thixotropic paste
• Features: non-abrasive, fine Boron Nitride Filler, high Glass Transition Temperature, excellent thermal stability, highly electrically insulating

• Number of Components: 2
• Typical Cure Schedule:  23 °C / 24 hours
• Operating Temperature: 190 °C
• Consistency: thixotropic paste
• Features: non-abrasive Boron Nitride Filler, high thermal conductivity (1,8 W/mK),  highly electrically insulating

• Number of Components: 2
• Typical Cure Schedule:  150 °C / 15 minutes
• Operating Temperature: ca. 220 °C
• Consistency: thixotropic paste
• Features: non-abrasive Boron Nitride Filler, very good thermal conductivity (2 W/mK), high Glass Transition Temperature, excellent thermal stability, highly electrically insulating

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 24 hours
• Operating Temperature: -55 °C ... 180 °C
• Consistency: flowable soft paste
• Features: thermally conductive adhesive and potting compound, cures at room temperature, excellent adhesion on most substrates