Duralco® 4460

• Number of Components: 2
• Typical Cure Schedule: 120 °C / 4 hours
• Operating Temperature: -50 °C … +315°C
• Consistency: 1 600 mPas
• Features: Low viscosity and ultra temperature adhesive for sensors and plug-in contacts

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 24 hours + 120 °C / 1 hour and 180 °C / 1 hour
• Operating Temperature: -50 °C … 260 °C
• Consistency: low viscosity
• Features: Low viscosity adhesive, potting and encapsulant. Ideal for ultra thin bond lines, sealing porous materials and protecting, bonding and coating critical electronic components, etc.

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 16-24 hours or 120 °C / 5 minutes
• Operating Temperature: -50 °C … 260 °C
• Consistency: 12 400 mPas
• Features: Electrically resistant, all purpose potting - Small parts potting for electronics, or sensor potting with good thermal conductivity, D90

• Number of Components: 2
• Typical Cure Schedule: 25 °C / 16-24 hours or 120 °C / 5 minutes
• Operating Temperature: -50 °C bis +260 °C
• Consistency: 24 000 mPas
• Features: Sensor sealing, D90, thermal conductivity 1.85 W / mK

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 16 - 24 hours or 120 °C / 1 hour
• Operating Temperature: -50 °C … +220 °C
• Consistency: 10 000 mPas
• Features: Flexibility (Shore hardness) adaptable by adjusting the mixing ratio, dry surface, good adhesion to Teflon, ideal for all electrical and electronic applications

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 4 - 16 hours
• Operating Temperature: 260 °C
• Consistency: pasty
• Features: Adhesive for magnet and ferrite bonding. Free of magnetic particles or conductive fillers.