Durapot® 861

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 16 - 24 hours or 120 °C / 5 minutes
• Operating Temperature: -50 °C bis +260 °C
• Consistency: 3 600 mPas
• Features: Low-viscosity, unfilled potting compound for larger volumes

• Number of Components: 2
• Typical Cure Schedule: 120 °C / 4 hours or 180 °C / 1 hour
• Operating Temperature: -50 °C up to +315 °C
• Consistency: 1 600 mPas
• Features: Hot-curing potting compound, unfilled

• Number of Components: 2
• Typical Cure Schedule: 120 °C / 4 hours or 180 °C / 1 -2 hours
• Operating Temperature: -50 °C … +315 °C
• Consistency: 2 000 mPas
• Features: Ultra high temp. potting with low thermal expansion and low water absorption. Commonly used in electronic assemblies to prevent vibration damage.

• Number of Components: 2
• Typical Cure Schedule: 23 °C / 24 hours or 120 °C / 10 minutes
• Operating Temperature: -50 °C … +260 °C
• Consistency: 10 000 mPas
• Features: Thermally insulating potting compound

• Number of Components: 2
• Typical Cure Schedule: 120 °C / 2 - 4 hours or 180 °C / 1 hour
• Operating Temperature: up to 260 °C
• Consistency: 800 mPas
• Features: High temp. flexible epoxy ideal for thermal shock applications, stress free potting and bonding